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The technique of laser-assisted nanoimprinting lithography (LAN) has beenproposed to utilize an excimer laser to irradiate through a quartz mold andmelts a thin polymer film on the substrate for micro- to nano-scaledfabrications. In the present study, the novel concept of that copper wasadopted as the substrate instead of silicon, which is conventionally used, wasproposed. The micro/nano structures on the copper substrate could be fabricatedby chemical/electrochemical etching or electroforming ; following by thepatterns have been transferred onto the substrate using LAN process.Alternatives of the substrate materials could lead versatile applications inmicro/nano-fabrication. To demonstrate the feasibility of this conceptnumerically, this study introduced optical multiple reflection theory toperform both analytical and numerical modeling during the process and topredict the thermal response theoretically.

Numerical Investigation of Laser-Assisted Nanoimprinting on a Copper Substrate from a Perspective of Heat Transfer Analysis