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Micro-indentation test with a micro flat-end cone indenter was employed tosimulate micro embossing process and investigate the thermo-mechanical responseof ceramic green substrates. The laminated low temperature co-fired ceramicgreen tapes were used as the testing material ; the correlations of indentationdepth versus applied force and applied stress at the temperatures of 25 degreesC and 75degrees C were studied. The results showed that permanent indentationcavities could be formed at temperatures ranging from 25 degrees C to 75degrees C, and the depth of cavities created was applied force, temperature anddwell time dependent. Creep occurred and made a larger contribution to theplastic deformation at elevated temperatures and high peak loads. There wasinstantaneous recovery during the unloading and retarded recovery in the firstday after indentation. There was no significant pile-up due to material flowobserved under compression at the temperature up to 75 degrees C. The plasticdeformation was the main cause for formation of cavity on the ceramic greensubstrate under compression. The results can be used as a guideline forembossing ceramic green substrates.

Study of mechanical response in embossing of ceramic green substrate by micro-indentation