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The reported research work presents numerical studies validated byexperimental results of a flat micro heat pipe with sintered copper wickstructure. The objectives of this project are to produce and demonstrate theefficiency of the passive cooling technology (heat pipe) integrated in a verythin electronic substrate that is a part of a multifunctional 3-D electronicpackage. The enhanced technology is dedicated to the thermal management of highdissipative microsystems having heat densities of more than 10W/cm2. Futureapplications are envisaged in the avionics sector. In this research 2Dnumerical hydraulic model has been developed to investigate the performance ofa very thin flat micro heat pipe with sintered copper wick structure, usingwater as a refrigerant. Finite difference method has been used to develop themodel. The model has been used to determine the mass transfer and fluid flow inorder to evaluate the limits of heat transport capacity as functions of thedimensions of the wick and the vapour space and for various copper spheresradii. The results are presented in terms of liquid and vapour pressures withinthe heat pipe. The simulated results are validated by experiments and provedthat the method can be further used to predict thermal performance of the heatpipe and to optimise its design.

Evaluation of the thermal and hydraulic performances of a very thin sintered copper flat heat pipe for 3D microsystem packages