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Micromechanical devices like accelerometers or rotation sensors form anincreasing segment beneath the devices supplying the consumer market. A hybridintegration approach to build smart sensor clusters for the precise detectionof movements in all spatial dimensions requires a large toolbox of interconnecttechnologies, each with its own constraints regarding the total processintegration. Specific challenges described in this paper are post-CMOSfeedthroughs, front-to-front die contact arrays, vacuum-compliant lateralinterconnect and fine-pitch solder balling to finally form a Chip-ScaleSystem-in-Package (CSSiP).

Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems