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A cost effectively method to fabricate nanopores in silicon by only using theconventional wet-etching technique is developed in this research. The mainconcept of the proposed method is a two-step etching process, including apremier double-sided wet etching and a succeeding track-etching. A specialfixture is designed to hold the pre-etched silicon wafer inside it such thatthe track-etching can be effectively carried out. An electrochemical system isemployed to detect and record the ion diffusion current once the pre-etchedcavities are etched into a through nanopore. Experimental results indicate thatthe proposed method can cost effectively fabricate nanopores in silicon.

A Two-Step Etching Method to Fabricate Nanopores in Silicon