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Deflection behavior of several encapsulant materials under uniform pressurewas studied to determine the best encapsulant for MEMS device. Encapsulation isneeded to protect movable parts of MEMS devices during high pressure transfermolded packaging process. The selected encapsulant material has to have surfacedeflection of less than 5 ?m under 100 atm vertical loading. Deflection wassimulated using CoventorWare ver.2005 software and verified with calculationresults obtained using shell bending theory. Screening design was used toconstruct a systematic approach for selecting the best encapsulant material andthickness under uniform pressure up to 100 atm. Materials considered for thisstudy were polyimide, parylene C and carbon based epoxy resin. It was observedthat carbon based epoxy resin has deflection of less than 5 ?m for allthickness and pressure variations. Parylene C is acceptable and polyimide isunsuitable as high strength encapsulant. Carbon based epoxy resin is consideredthe best encapsulation material for MEMS under high pressure packaging processdue to its high strength.

Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging