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Microelectromechanical systems (MEMS) technologies are developing rapidlywith increasing study of the design, fabrication and commercialization ofmicroscale systems and devices. Accurate knowledge on the mechanical behaviorsof thin film materials used for MEMS is important for successful design anddevelopment of MEMS. Here a novel electroplating spring-bridge micro-tensilespecimen integrates pin-pin align holes, misalignment compensate spring, loadsensor beam and freestanding thin film is demonstrated and fabricated. Thespecimen is fit into a specially designed micro-mechanical apparatus to carryout a series of monotonic tensile testing on sub-micron freestanding thinfilms. Certain thin films applicable as structure or motion gears in MEMS weretested including sputtered gold, copper and tantalum nitride thin films. Metalspecimens were fabricated by sputtering; for tantalum nitride film samples,nitrogen gas was introduced into the chamber during sputtering tantalum filmson the silicon wafer. The sample fabrication method involves three steps oflithography and two steps of electroplating copper to hold a dog bonefreestanding thin film. Using standard wet etching or lift off techniques, aseries of microtensile specimens were patterned in metal thin films, holes, andseed layer for spring and frame structure on the underlying silicon oxidecoated silicon substrate. Two steps of electroplating processing to distinctspring and frame portion of the test chip. Finally, chemical etched away thesilicon oxide to separated electroplated specimen and silicon substrate.

Monotonic and fatigue testing of spring-bridged freestanding microbeams application for MEMS