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In this work, we present a fully parameterized capped transmission line modelfor electromagnetic optimization of a wafer level package (WLP) for RF MEMSapplications using the Ansoft HFSS-TM electromagnetic simulator. All thedegrees of freedom (DoF's) in the package fabrication can be modified withinthe model in order to optimize for losses and mismatch (capacitive andinductive couplings) introduced by the cap affecting the MEMS RF behaviour.Ansoft HFSS-TM was also validated for the simulation of capped RF MEMS devicesby comparison against experimental data. A test run of capped 50 transmissionlines and shorts was fabricated and tested.

A Fully Parameterized Fem Model for Electromagnetic Optimization of an RF Mems Wafer Level Package