English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Zendy Plus

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Zendy Tools

Zendy Open

The suspended electrothermal polysilicon micro beams generate displacementsand forces by thermal buckling effects. In the previous electro-thermal andthermo-elastic models of suspended polysilicon micro beams, thethermo-mechanical properties of polysilicon have been considered constant overa wide rang of temperature (20- 900 degrees C). In reality, thethermo-mechanical properties of polysilicon depend on temperature and changesignificantly at high temperatures. This paper describes the development andvalidation of theoretical and Finite Element Model (FEM) including thetemperature dependencies of polysilicon properties such as thermal expansioncoefficient and Young's modulus. In the theoretical models, two parts ofelastic deflection model and thermal elastic model of micro beams buckling havebeen established and simulated. Also, temperature dependent buckling ofpolysilicon micro beam under high temperature has been modeled by FiniteElement Analysis (FEA). Analytical results and numerical results using FEA arecompared with experimental data available in literature. Their reasonableagreement validates analytical model and FEM. This validation indicates theimportance of including temperature dependencies of polysiliconthermo-mechanical properties such as Coefficient of Thermal Expansion (CTE) inthe previous models.

Analysis of polysilicon micro beams buckling with temperature-dependent properties