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Based on simplified one-dimensional steady-state analysis of thermoelectricphenomena and on analogies between thermal and electrical domains, we proposeboth lumped and distributed parameter electrical models for thermoelectricdevices. For lumped parameter models, constant values for material propertiesare extracted from polynomial fit curves evaluated at different moduletemperatures (hot side, cold side, average, and mean module temperature). Forthe case of distributed parameter models, material properties are calculatedaccording to the mean temperature at each segment of a sectioned device. Acouple of important advantages of the presented models are that temperaturedependence of material properties is considered and that they can be easilysimulated using an electronic simulation tool such as SPICE. Comparisons aremade between SPICE simulations for a single-pellet module using the proposedmodels and with numerical simulations carried out with Mathematica software.Results illustrate accuracy of the distributed parameter models and show howinappropriate is to assume, in some cases, constant material parameters for anentire thermoelectric element.

Lumped and Distributed Parameter SPICE Models of TE Devices Considering Temperature Dependent Material Properties