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This paper presents the different processing steps of a new generic surfacemicromachining module for MEMS hermetic packaging at temperatures around 180degrees C based on nickel plating and photoresist sacrificial layers. Theadvantages of thin film caps are the reduced thickness and area consumption andthe promise of being a low-cost batch process. Moreover, sealing happens by areflow technique, giving the freedom of choosing the pressure and atmosphereinside the cavity. Sacrificial etch holes are situated above the deviceallowing shorter release times compared to the state-of-the-art. With theso-called over-plating process, small etch holes can be created in the membranewithout the need of expensive lithography tools. The etch holes in the membranehave been shown to be sufficiently small to block the sealing material to passthrough, but still large enough to enable an efficient release.

A Generic Surface Micromachining Module for Mems Hermetic Packaging at Temperatures Below 200 degrees C