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Microelectromechanical systems (MEMS) technologies are developing rapidlywith increasing study of the design, fabrication and commercialization ofmicroscale systems and devices. Accurate mechanical properties are importantfor successful design and development of MEMS. We have demonstrated here anovel electroplating spring frame MEMS Structure Specimen integrates pin-pinalign holes, misalignment compensate spring structure frame, load sensor beamand freestanding thin film. The specimen can be fit into a specially designedmicrotensile apparatus which is capable of carrying out a series of tests onsub-micro scale freestanding thin films.

Design and Development of Novel Electroplating Spring Frame Mems Structure Specimens for the Microtensile Testing of Thin Film Materials