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This paper reports on the systematic electromechanical characterization of anew three-axial force sensor used in dimensional metrology of micro components.The siliconbased sensor system consists of piezoresistive mechanicalstresstransducers integrated in thin membrane hinges supporting a suspended flexiblecross structure. The mechanical behavior of the fragile micromechanicalstructure isanalyzed for both static and dynamic load cases. This workdemonstrates that the silicon microstructure withstands static forces of 1.16Napplied orthogonally to the front-side of the structure. A statistical Weibullanalysis of the measured data shows that these values are significantly reducedif the normal force is applied to the back of the sensor. Improvements of thesensor system design for future development cycles are derived from themeasurement results.

Electromechanical Reliability Testing of Three-Axial Silicon Force Sensors