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Advances in material processing such as silicon micromachining are openingthe way to vacuum microelectronics. Two-dimensional vacuum components can befabricated using the microsystems processes. We developed such devices using asingle metal layer and silicon micromachining by DRIE. The latter technologicalstep has significant impact on the characteristics of the vacuum components.This paper presents a brief summary of electron emission possibilities and thedesign leading to the fabrication of a lateral field emission diode. Firstmeasurement results and the aging of the devices are also discussed.

Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching