English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

This paper presents the effectiveness of various stress conditions (mainlyvoltage and frequency) on detecting the resistive shorts and open defects indeep sub-micron embedded memories in an industrial environment. Simulationstudies on very-low voltage, high voltage and at-speed testing show the need ofthe stress conditions for high quality products; i.e., low defect-per-million(DPM) level, which is driving the semiconductor market today. The above testconditions have been validated to screen out bad devices on real silicon (atest-chip) built on CMOS 0.18 um technology. IFA (inductive fault analysis)based simulation technique leads to an efficient fault coverage and DPMestimator, which helps the customers upfront to make decisions on testalgorithm implementations under different stress conditions in order to reducethe number of test escapes.

Memory Testing Under Different Stress Conditions: An Industrial Evaluation