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In recent years, interfacial fracture becomes one of the most importantproblems in the assessment of reliability of electronics packaging. Especially,underfill resin is used with solder joints in flip chip packaging forpreventing the thermal fatigue fracture in solder joints. In general, theinterfacial strength has been evaluated on the basis of interfacial fracturemechanics concept. However, as the size of devices decrease, it is difficult toevaluate the interfacial strength quantitatively. Most of researches in theinterfacial fracture were conducted on the basis of the assumption of theperfectly bonding condition though the interface has the micro-scale structureand the bonding is often imperfect. In this study, the mechanical model of theinterfacial structure of resin in electronic components was proposed.Bimaterial model with the imperfect bonding condition was examined by using afinite element analysis (FEA). Stress field in the vicinity of interfacedepends on the interfacial structure with the imperfect bonding. In the frontof interfacial crack tip, the behavior of process zone is affected byinterfacial structure. However, the instability of fracture for macroscopiccrack which means the fracture toughness is governed by the stress intensityfactor based on the fracture mechanics concept.

Modeling with structure of resins in electonic compornents