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The results of investigation of kinetics of nanopores filling into membranesfrom aluminum oxide (pore diameter - 200 nm, porosity ~ 50%) atelectrodeposition of copper and silver are described. It is shown, that atidentical quantity of electricity passed through solutions, the degree of poresfilling by metal (average thickness of a deposit) is various for copper andsilver deposition. Calculated (according Faraday Law) and experimentaldependences of deposition rates of these metals on quantity of electricitypassed at direct and pulse currents are presented. Galvanodynamic i - vdependences have been obtained at various current scanning rates. The smallerrate of deposition allows to decrease concentration limitations of electrodeprocess and to obtain higher average thickness of metal deposits and higherfilling degree. The limiting values of quantity of electricity for direct andpulse currents were determined. The average thickness of silver and copperdeposits was obtained. A degree of pores filling, the morphology and chemicalmicroanalysis were studied on cross-section of the membrane, using TESCAN SEMequipped with an Oxford Instruments INCA Enerqy EDX-system.

Kinetics of Electrodeposition of Silver and Copper at Template Synthesis of Nanowires