Wafer Preparation Parameter Optimization for Wafer Defects Elimination

In every new technology developed and introduced to the manufacturing floor, particularly in the wafer preparation, entails problems that later induce defects affecting the wafer yield. This paper discusses the optimization of wafer preparation parameters, particularly the tensionless backgrinding tape lamination and DAF cut vacuum control, that mitigates wafer yield detractors such as edge cut, kerf shift and dice pop-out. Based on the evaluation results, tensionless backgrinding lamination affects the kerf shifting and edge cutting, and with proper vacuum control to attain zero dice pop-out process.