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Review on Reliability Test Method for Optical/Thermofluidic Micro Component
Author(s) -
;;;;
Publication year - 2004
Publication title -
transactions of materials processing
Language(s) - English
Resource type - Journals
eISSN - 2287-6359
pISSN - 1225-696X
DOI - 10.5228/kspp.2004.13.3.242
Subject(s) - reliability (semiconductor) , miniaturization , reliability engineering , component (thermodynamics) , microelectromechanical systems , characterization (materials science) , process (computing) , engineering , computer science , mechanical engineering , electronic engineering , electrical engineering , materials science , nanotechnology , physics , quantum mechanics , thermodynamics , operating system , power (physics)

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