Open AccessNano-joining Mechanisms and Joint Reliability of Die Attachment Using Bimodal-sized Cu Nanoparticle Paste Capable of Low-temperature Pressureless Sintering
Author(s) -
Hui Huang,
Zhou Minbo,
Xue Wang,
Xin-Ping Zhang
Publication year - 2022
Publication title -
jixie gongcheng xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.216
H-Index - 12
ISSN - 0577-6686
DOI - 10.3901/jme.2022.02.058
Subject(s) - sintering , materials science , die (integrated circuit) , joint (building) , nanoparticle , nano , reliability (semiconductor) , composite material , pressureless sintering , metallurgy , nanotechnology , structural engineering , engineering , thermodynamics , power (physics) , physics