Open AccessNumerical Study on the Improvement of the Cooling of Ah Microprocessor by the use of Nanofluids
Author(s) -
Djedid Taloub,
Abdelkarim Bouras,
Zied Driss
Publication year - 2022
Publication title -
wseas transactions on heat and mass transfer
Language(s) - English
Resource type - Journals
eISSN - 2224-3461
pISSN - 1790-5044
DOI - 10.37394/232012.2022.17.8
Subject(s) - nanofluid , materials science , heat transfer , heat transfer enhancement , volume fraction , enclosure , natural convection , rayleigh number , thermodynamics , thermal conductivity , mechanics , volume (thermodynamics) , thermal , composite material , mechanical engineering , heat transfer coefficient , engineering , physics , electrical engineering
The numerical study on the improvement of the cooling of a microprocessor by the use of Nanofluids has been made. Natural convection is analyzed in a box fence with a temperature source encountered at its lower border and loaded with an Ethylene Glycol-Copper nanoparticle. This article explores the influences of relevant aspects such as thermal Rayleigh number, solid volume fraction, and enclosure dimensions on the thermal efficacy of the box fence, which are enhanced with an enlargement in thermal Rayleigh number and solid volume fraction. The results also illustrate that the change of the warmth transfer rate concerning the box dimensions of the enclosure is unlike at inferior and elevated thermal Rayleigh numbers. A simile is offered between the upshots got and the literature. Results were presented in terms of heat transfer rate depending on thermal Rayleigh number (Rat = 10^3 , and 10^6 ), nanoparticle solid volume fraction (0 ≤ φ < 5%), and box dimensions. The results show that raising the solid volume fraction of the nanoparticles (φ = 5%) drive a rise in the efficient conductivity of the working fluid and consequently the improvement of the heat transfer rate by approximately ≈ 10% per compared to the base fluid case.