Open AccessNotes on the ASME International Electronics Packaging Conference
Author(s) -
Peter A. Engel
Publication year - 1993
Publication title -
journal of electronic packaging
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.523
H-Index - 52
eISSN - 1528-9044
pISSN - 1043-7398
DOI - 10.1115/1.2909342
Subject(s) - electronics , electronic packaging , engineering , mechanical engineering , electrical engineering , engineering physics , materials science , manufacturing engineering
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