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Assessment of Strength by Young's Modulus and Porosity: A Critical Evaluation
Author(s) -
DUTTA S.K.,
MUKHOPADHYAY A.K.,
CHAKRABORTY D.
Publication year - 1988
Publication title -
journal of the american ceramic society
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.9
H-Index - 196
eISSN - 1551-2916
pISSN - 0002-7820
DOI - 10.1111/j.1151-2916.1988.tb07563.x
Subject(s) - porosity , materials science , modulus , silicon nitride , composite material , young's modulus , nitride , flexural strength , silicon , metallurgy , layer (electronics)
Literature data on strength, porosity, and Young's modulus at room temperature of reaction‐bonded silicon nitride, sintered silicon nitride, and hot‐pressed silicon nitride have been fitted into available and proposed strength‐porosity relationships. In general, the Lewis method of iterative least‐squares fitting in these relationships has been found to be better than conventional linearized least‐squares fitting. Further a semiempirically proposed strength–Young's modulus relationship has been found to predict strength more precisely than the conventional strength‐porosity relationship.
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