Open AccessThe 2021 flexible and printed electronics roadmap
Author(s) -
Yvan Bonnassieux,
Christoph J. Brabec,
Yue Cao,
Tricia Breen Carmichael,
Michael L. Chabinyc,
Kai Cheng,
Gyoujin Cho,
Anjung Chung,
Corie L. Cobb,
Andreas Distler,
Hans Joachim Egelhaaf,
Gerd Grau,
Xiaojun Guo,
Ghazaleh Haghiashtiani,
Tsung Ching Huang,
Muhammad Mustafa Hussain,
Benjamı́n Iñiguez,
Taik Min Lee,
Ling Li,
Yan Ma,
Dongge Ma,
Michael C. McAlpine,
Tse Nga Ng,
Ronald Österbacka,
Shrayesh N. Patel,
Junbiao Peng,
Huisheng Peng,
Jonathan Rivnay,
Leilai Shao,
Daniel Steingart,
R. A. Street,
Vivek Subramanian,
Luisa Torsi,
Yunyun Wu
Publication year - 2021
Publication title -
flexible and printed electronics
Language(s) - English
Resource type - Journals
ISSN - 2058-8585
DOI - 10.1088/2058-8585/abf986
Subject(s) - vision , electronics , technology roadmap , resource (disambiguation) , systems engineering , key (lock) , nanotechnology , field (mathematics) , computer science , engineering , manufacturing engineering , electrical engineering , materials science , business , computer network , philosophy , theology , computer security , mathematics , marketing , pure mathematics
This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.