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The removal of high heat fluxes from 100 W/cm 2  to 1000 W/cm 2  for microelectronics components is one of the difficult tasks in the field of applied thermal physics. One of the important parameters in the task of cooling the intensely heated surfaces of the elements of microelectronics is the surface temperature depending on the operation time. This work is an experimental study of the influence of controlled pulsations of a liquid flow in a two-phase system on the temperature of the heater surface depending on the heat flux. It is shown that for a heat flux of more than 80% of the critical heat flux, the temperature change on the surface of the heater can reach up to 15 °C, which can adversely affect the operation of the cooled chip. In the case of less than 80% of the critical heat flux, the temperature change is less than 4 °C, allowing the cooled chip to work in a stable mode. It is shown that in the case of controlled pulsations of the liquid flow, subregimes are formed with different duration of existence.

Influence of controlled pulsations of a liquid flow on the surface temperature of heater with a high heat flux