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Transport of Heat between Electrons and Phonons in Copper below 0.2 K
Author(s) -
Peterson R. E.,
Anderson A. C.
Publication year - 1973
Publication title -
physica status solidi (b)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.51
H-Index - 109
eISSN - 1521-3951
pISSN - 0370-1972
DOI - 10.1002/pssb.2220560123
Subject(s) - mean free path , copper , phonon , electron , condensed matter physics , thermal , materials science , physics , thermodynamics , quantum mechanics , metallurgy
Abstract The thermal resistance between phonons and electrons has been measured in thin copper samples at temperatures from 0.03 to 0.2 K. The measurements are in qualitative agreement with a calculation based on the free‐electron model, except the temperature dependence changes to T‐ 3 from the expected T‐ 4 as the electron mean free path becomes limited by sample boundaries.