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Growth of Ni–B films on n‐silicon
Author(s) -
Mondal Anup,
Nath Sabyashachi,
Mondal Ashok,
Bandopadhyay Sikha,
Gangopadhyay Utpal,
Saha Hiranmay
Publication year - 2005
Publication title -
physica status solidi (a)
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.532
H-Index - 104
eISSN - 1862-6319
pISSN - 1862-6300
DOI - 10.1002/pssa.200420042
Subject(s) - silicon , ohmic contact , deposition (geology) , materials science , sodium borohydride , contact resistance , chemical engineering , sheet resistance , reducing agent , metallurgy , nanotechnology , chemistry , layer (electronics) , catalysis , organic chemistry , paleontology , sediment , engineering , biology
Electroless deposition of Ni–B films on n‐silicon has been developed, using sodium borohydride as the reducing agent. The deposition has been studied by varying the temperature, time of deposition and the concentration of the reducing agent used, keeping the pH of the solution unchanged. Sheet resistance of the deposited films were measured to confirm the growth. Preliminary studies on contact resistance between Ni–B film and n‐Si have been carried out. Results are found to be similar to contact resistance between Ni–B and p‐silicon, suggesting that ohmic contacts to n‐Si can be achieved even with Ni–B. This has been done with a view to deposit Ni simultaneously on both the front and back sides of a silicon solar cell, from the same solution. (© 2005 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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