Indentation measurements using a dynamic mechanical analyzer | Zendy

Payne Jason A. | Zendy; Strojny Angela | Zendy; Francis Lorraine F. | Zendy; Gerberich William W. | Zendy

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Indentation measurements using a dynamic mechanical analyzer

Author(s) -

Payne Jason A.,

Strojny Angela,

Francis Lorraine F.,

Gerberich William W.

Publication year - 1998

Publication title -

polymer engineering and science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.503

H-Index - 111

eISSN - 1548-2634

pISSN - 0032-3888

DOI - 10.1002/pen.10323

Subject(s) - materials science , nanoindentation , composite material , indentation , brittleness , elastic modulus , micrometer , diamond , hydrostatic pressure , optics , physics , thermodynamics

A dynamic mechanical analyzer equipped with a diamond indenter tip was used to measure the elastic modulus of polymeric coatings as well as various bulk materials. A fabricated indenter probe was used to indent bulk samples of aluminum and fused quartz, as well as gelatin and polystyrene films in order to compare the micron‐level indentation measurements with sub‐micron (nanoindentation) techniques. The measured moduli were in agreement for ductile materials and thick films (>20 μm), but limited displacement resolution, material cracking, and hydrostatic pressure effects led to diverging values for thinner coatings and more brittle materials.

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