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A dual‐band class‐E power amplifier with concurrent matching network in 0.18‐μm CMOS
Author(s) -
Lin WenJie,
Huang PoShun,
Cheng JenHao,
Tsai JengHan,
Alsuraisry Hamed,
Huang TianWei
Publication year - 2018
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.31220
Subject(s) - multi band device , amplifier , cmos , impedance matching , electrical engineering , power added efficiency , rf power amplifier , chip , electronic engineering , electrical impedance , engineering , antenna (radio)
In this letter, a dual‐band class‐E CMOS power amplifier (PA) in 0.18‐μm CMOS process is presented. By using concurrent dual‐band impedance matching network, the proposed dual‐band PA can achieve high efficiency in a compact chip area. This dual‐band class‐E PA demonstrates the power gain ≥ 8.4 dB, P sat ≥ 21.4 dBm with power added efficiency ≥ 31% in a compact chip size of 0.5 mm 2 . This dual‐band class‐E PA achieves comparable power area density of 284.5 (mW/mm 2 ) with other state‐of‐the‐art class‐E PAs at higher frequency.
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