Premium
Broadband parametric representation of packaged MEMS interconnects using a state space spectral model
Author(s) -
Naishadham K.,
Muldavin J.,
Piou J. E.
Publication year - 2008
Publication title -
microwave and optical technology letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.304
H-Index - 76
eISSN - 1098-2760
pISSN - 0895-2477
DOI - 10.1002/mop.23402
Subject(s) - broadband , electronic engineering , scattering parameters , microelectromechanical systems , parametric statistics , microwave , state space representation , representation (politics) , transmission line , state space , engineering , electric power transmission , interconnection , computer science , electrical engineering , telecommunications , physics , algorithm , optoelectronics , mathematics , statistics , politics , law , political science
This article presents a robust measurement‐based spectral model, derived from an all‐pole state‐space system representation of the scattering parameters, for the broadband characterization of low‐loss packaged MEMS circuits. The proposed method is illustrated by extracting distributed transmission line parameters of a MEMS interconnect, which accounts for discontinuities and package‐specific parasitic effects. It is shown that the state space method (SSM) effectively filters out measurement noise and facilitates extraction of frequency‐dependent parameters. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1482–1485, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23402
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom