De‐embedding PCB fixtures for package characterization | Zendy

Wartenberg Scott A. | Zendy; Grajek Phillip | Zendy

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De‐embedding PCB fixtures for package characterization

Author(s) -

Wartenberg Scott A.,

Grajek Phillip

Publication year - 2001

Publication title -

microwave and optical technology letters

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.304

H-Index - 76

eISSN - 1098-2760

pISSN - 0895-2477

DOI - 10.1002/mop.1372

Subject(s) - test fixture , fixture , embedding , microwave , characterization (materials science) , engineering , electronic engineering , printed circuit board , hinge , electrical engineering , surface mount technology , device under test , quad flat no leads package , scattering parameters , mechanical engineering , computer science , materials science , telecommunications , nanotechnology , artificial intelligence , adhesive , layer (electronics)

Device characterization hinges on precise measurements of the device under test (DUT). When it cannot be probed directly, mount the package to a PCB fixture. While this makes measurement easy, separating the effects of the DUT from the PCB carrier can be difficult. This paper illustrates a method of de‐embedding the package S ‐parameters from those of the PCB. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 31: 111–112, 2001.

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