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29.3: Invited Paper : The Mechanical Reliability of Flexible ALD Barrier Films
Author(s) -
Bulusu Anuradha,
Behm Henrik,
SadeghiTohidi Farzad,
Bahre Hendrick,
Baumert Eva,
Samet David,
Hopmann Christian,
Winter Jörg,
Pierron Olivier,
Graham Samuel
Publication year - 2013
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2013.tb06221.x
Subject(s) - materials science , strain (injury) , atomic layer deposition , composite material , layer (electronics) , reliability (semiconductor) , fatigue testing , physics , medicine , power (physics) , quantum mechanics
In this paper, we present the results of mechanical testing that reveals the onset crack strain and fatigue crack growth of TiO 2 and Al 2 O 3 films deposited by atomic layer deposition. Data show that both films have a strong thickness dependence of the onset crack strain, with the strain reducing with increasing film thickness. Additionally, TiO 2 films have a lower onset crack strain and strain for fatigue damage than Al 2 O 3 . However, TiO 2 films are more resilient in harsh environments where fatigue damage in Al 2 O 3 films grows faster.
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