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23.3: Invited Paper : Upgrading Self‐Aligned Imprint Lithography (SAIL) in Preparation for Roll‐to‐Roll Manufacturing of Large‐Sized High‐Performance Flexible Electronics
Author(s) -
Kim HanJun,
Elder Richard,
Vornbrock Alejandro de la Fuente,
Hoffman Randy,
Holland Edward,
Jeans Albert,
Luo Hao,
Maltabes John,
Mei Ping,
Perlov Craig,
Taussig Carl,
Morrison Neil
Publication year - 2013
Publication title -
sid symposium digest of technical papers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.351
H-Index - 44
eISSN - 2168-0159
pISSN - 0097-966X
DOI - 10.1002/j.2168-0159.2013.tb06199.x
Subject(s) - lithography , roll to roll processing , backplane , manufacturing engineering , electronics , engineering , flexible electronics , materials science , nanotechnology , mechanical engineering , electrical engineering , optoelectronics
Abstract Self‐aligned imprint lithography (SAIL) is currently being upgraded to a next stage to better address the needs for roll‐to‐roll compatible manufacturing of large‐sized flexible OLED display backplanes. Cu and oxide semiconductors are preferred choices of materials, and control of process and yield becomes even more important an issue.

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