z-logo
Premium
The properties of soldering mask hardened by means of UV using acrylate and methacrylate oligomers
Author(s) -
Matynia Tadeusz,
Kutyłkea Romualda,
Bukat Krystyna,
Pieńkowska Barbara
Publication year - 1995
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1995.070551109
Subject(s) - triethylene glycol , acrylate , materials science , methacrylate , polymer chemistry , thixotropy , monomer , soldering , composite material , polymer
The properties of soldering masks based on epoxyacrylic, epoxymethacrylic esters, and monomers: 2‐ethylhexyl acrylate, triethylene glycol dimethacrylate, and triethylene glycol phthalate dimethacrylate have been described. The thixotropic properties, printability, adhesion to the surface, and resistance to soldering have been determined. © 1995 John Wiley & Sons, Inc.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom