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Study of the thermoformability of ethylene‐vinyl alcohol copolymer based barrier blends of interest in food packaging applications
Author(s) -
Giménez E.,
Lagarón J. M.,
Cabedo L.,
Gavara R.,
Saura J. J.
Publication year - 2004
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.13584
Subject(s) - thermoforming , materials science , ionomer , composite material , copolymer , polyamide , vinyl alcohol , ternary operation , amorphous solid , polymer blend , polymer , chemistry , organic chemistry , computer science , programming language
Abstract The thermoforming capacity of a number of blends of an ethylene‐vinyl alcohol copolymer (EVOH‐32, with 32 mol % ethylene) with amorphous polyamide (aPA) and/or Nylon‐containing ionomer with interest in multilayer food packaging structures have been studied. These blends were vacuum‐thermoformed between 100 and 150°C onto male molds of different shapes and areal draw ratios. It was found that EVOH/aPA extruded blends did not improve the inherently poor formability of EVOH alone. In contrast, significant improvements in thermoformability were achieved by blending EVOH with a compatibilized‐ionomer. Optimum forming capacity was achieved in a ternary blend by addition of a compatibilized‐ionomer to EVOH/aPA blends in the range of 140–150°C. Analysis of wall thickness data obtained in the thermoformed parts showed that wall thickness was significantly affected by the ionomer and amorphous polyamide content in the blend. The ternary blend showed a lower thickness reduction in the critical areas, as well as a higher uniformity in the part. A finite element analysis was used to evaluate the wall thickness distribution and the modeling results were compared with the thermoforming experiments. The simulations were performed for the vacuum‐forming process employing a nonlinear elastic material model. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 96: 3851–3855, 2004