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This whitepaper summarizes the status, plans, and challenges in the area ofintegrated circuit design in the United States for future High Energy Physics(HEP) experiments. It has been submitted to CPAD (Coordinating Panel forAdvanced Detectors) and the HEP Community Summer Study 2013(Snowmass on theMississippi) held in Minnesota July 29 to August 6, 2013. A workshop titled: USWorkshop on IC Design for High Energy Physics, HEPIC2013 was held May 30 toJune 1, 2013 at Lawrence Berkeley National Laboratory (LBNL). A draft of thewhitepaper was distributed to the attendees before the workshop, the contentwas discussed at the meeting, and this document is the resulting final product.The scope of the whitepaper includes the following topics: Needs for ICtechnologies to enable future experiments in the three HEP frontiers Energy,Cosmic and Intensity Frontiers; Challenges in the different technology andcircuit design areas and the related R&D needs; Motivation for using differentfabrication technologies; Outlook of future technologies including 2.5D and 3D;Survey of ICs used in current experiments and ICs targeted for approved orproposed experiments; IC design at US institutes and recommendations forcollaboration in the future.

Integrated Circuit Design in US High-Energy Physics