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This paper presents a kinetic data on the hydrometallurgical recovery of some metal ions from a printed circuit board (PCB) of a spent cell phone by hydrochloric acid leaching. The effects of acid concentration, temperature and particle diameter on the dissolution efficiency at various leaching time intervals were examined. The results of the leaching investigations showed that the powdered cell phone dissolution increases with increasing acid concentration, system temperature with decreasing particle diameter at 360 rpm. With 2M HCl solution, about 88.49% of the sample was dissolved within 120 minutes using 0.075-0.112 mm particle diameter at 80 0 C. The results of the study indicated that the dissolution reaction could be represented by a shrinking core model with surface chemical reaction. A value of 0.61, 60.67 kJ/mol and 12.9s -1 were calculated as reaction order, activation energy and frequency factor, respectively for the dissolution process.

Quantitative Leaching of a Spent Cell Phone Printed Circuit Board by Hydrochloric acid