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Through experiment that does not cause wrinkles in the forming process for the primary purpose for install PCB(Printed circuit board) the thickness variation of the material was investigated. Experimental results was showed that the forming height of the first process had Influence Material thickness variation in the second process, in the first process, the Entrance corner of the die must have round of the product height of 50%, and The height of forming should be as high as the thickness of the material than the original forming. Also as do implement the forming shape in the first process, the thickness of the material is thinned to 85%, Restriking in the second process was that The thickness of the material is thinned to 80%. Therefore, In order to implement a precise shape, Thinking that the material thinning, The die was maintain the shape of the original product, and It was obtain the effect of the compression that the punch is to be longer, as the sum of more than 20% of the material thickness in the depth of the original product.

A Study on Material thickness variation of the circle formming shape for installing PCB