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A simple method to evaluate the hygroscopic characteristics of polymer of microelectronic plastic package is suggested. To evaluate the characteristics, specimens were prepared, and the internally absorbed moisture masses were measured as a function of the absorbing time and calculated numerically. The hygroscopic pressure ratio was calculated by heat transfer analysis supported by commercial FEM code because the hygroscopic diffusion equation has the same form as the heat transfer equation. The moisture masses were then summed by the self developed code. The nonconductive polymers had quite different characteristics for the different lots, even though they were the same products. The absorbed moisture mass variations were calculated for several different characteristics, and the optimal curve of the mass variation close to experimental data was selected, whose solubility and diffusivity were affected by the hygroscopic characteristics of the material. The method can be useful in the industrial fields to quickly characterize the polymer material of the semiconductor package because the fast correspondence is normally required in industry. The weight changes in the aluminum-nonconductive-polymer joint due to moisture absorption were measured. The deformed system was also measured using the Moire Interferometry system and compared with the results of finite element analysis.

Moire Interferometry Measurement and Numerical Analysis for Hygroscopic Swelling of Al-Polymer Joint