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In this paper, thermal analysis simulation program by taking advantage of COMSOL Multiphysics, LED Module for the production of the most preferred package type, omitting the COH Type COB Type and board simulation of the thermal analysis is in progress. LED Module that passes through the Heat-sink of the simulation results, depending on the location of the COB Type Max. Approximately 78℃ ~ Min. Approximately 62℃, COH Type the Max. Approximately 88℃ ~ Min. Approximately 67℃ has been confirmed that the temperature stability. Compared with COB Type Max. AIthough temperature difference is about 10 ℃, Min. At a temperature of about 5 ℃ confirmed to be enough to reduce the gap, LED Point confirming the results of the temperature curves for COB Type Max. Approximately 100 ℃ ~ Min. Approximately 77 ℃, COH Type the Max. Approximately 100 ℃ ~ Min. Approximately 86 ℃ temperature stability was confirmed that, COB Type COH Type, compared to approximately 10 ℃ temperature was higher. Key Words :

COB, COH Package LED Module Thermal Analysis Simulation