English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Tools annual

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Presents the access of premium content as premium feature

Premium Content

Global: Zendy Plus annual

Global: Zendy Free Plan

Article history: Received January 25, 2014 Received in Revised form May, 10, 2014 Accepted 7 June 2014 Available online 9 June 2014 Silicon/glass bi-materials are used in micro-assembly and packaging of microelectromechanical systems (MEMS) and micro-electronics devices. In this paper, maximum tangential stress (MTS) concept is used for determination of the fracture initiation angles of silicon/ glass bi-material notches. First, the MTS criterion is analytically formulated for a bimaterial notch problem. Then, the criterion used for prediction of fracture initiation angles of some experimental data given in literature for silicon/ glass bi-material notches. In addition, the modified MTS (MMTS) criterion, which considers the effect of I-stress, was compared with the MTS criterion and the experimental data. It was shown that MMTS criterion provides more accurate results than the MTS criterion for estimation of the fracture initiation angle. © 2014 Growing Science Ltd. All rights reserved.

Application of maximum tangential stress criterion in determination of fracture initiation angles of silicon/ glass anodic bonds