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The current contribution reports about the fabrication technology for thedevelopment of novel microfluidic impedance spectroscopy sensors that aredirectly attachable on 3-D molded interconnect devices (3D-MID) that provides an opportunity to create reduced-scale sensor devices for 3-D applications.Advantages of the MID technology in particular for an automotive industryapplication were recently discussed (Moser and Krause, 2006). An ability tointegrate electrical and fluidic parts into the 3D-MID platform brings asensor device to a new level of the miniaturization. The demonstrated sensoris made of a flexible polymer material featuring a system of electrodes thatare structured on and embedded in the SU-8 polymer. The sensor chips can bedirectly soldered on the MID due to the electroless plated contact pads. Aflip chip process based on the opposite electrode design and theimplementation of all fluidic and electrical connections at one side of thesensors can be used to assemble the sensor to a three-dimensional substrate.The developed microfluidic sensor demonstrated a predictable impedancespectrum behavior and a sufficient sensitivity to the concentration ofethanol in deionized water. To the best of our knowledge, there is no reportregarding such sensor fabrication technology

Flexible free-standing SU-8 microfluidic impedance spectroscopy sensor for 3-D molded interconnect devices application