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We developed the reliable flip chip mounting structure of VCSELs without hermetic sealing to realize 14 Gbps transmission modules. Underfill resin is sometimes used to protect VCSELs when hermetic sealing is not applied. However, it was shown that cracks occur inside VCSELs if Young’s modulus of underfill resin is high. The cracks can be prevented if we avoid the arrangement of underfill resin of high Young’s modulus on the mesa parts of VCSELs. We considered two mounting methods to prevent this failure. The first method is to use underfill resin of low Young’s modulus. The other uses a structure where the air caps cover the mesa parts. We evaluated these methods and confirmed that the cracks do not occur in either case.

Development of Underfilling Method for Flip Chip Mounted VCSEL