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There is a strong development activity constantly ongoing in the electronics packaging industry to find new and costeffective packaging solutions. At the same time that existing package technology solutions are being pushed to the limit, completely new and revolutionary electronics manufacturing solutions are emerging to the market. A great challenge in the ongoing development is to be able to create a package technology solution that provides further miniaturization and improved electrical performance with a cost effective and robust manufacturing concept. Imbera Electronics has developed several generations of Integrated Module Board (IMB) technology to embed discrete components inside an organic, low-cost PCB motherboard or substrate. The 1 st and 2 nd generations were initially developed in late 90’s at the Helsinki University of Technology. The current focus is in the 3 rd generation IMB technology developed by Imbera Electronics in 2003. The 3 rd generation technology provides a flexible platform for multiple component types from low- to mid-range I/O count components. In this paper the IMB technology concept is reviewed with a focus on technology capability, reliability, production quality and potential application areas. The cost impact of different production process alternatives are studied and reviewed. Also, an analysis of key cost drivers is presented.

IMB Technology for Embedded Active and Passive Components in SiP, SiB and Single IC Package Applications