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We have previously proposed an optoelectronic hybrid packaging configuration based on the concept of separating optical and electrical interconnections in the board-level optical interconnection. The proposed board consists of a plastic optical fiber wiring sheet with an“opening”equipped with right-angle-turn optical interface connector for interconnecting optical-I/O interface multichip modules. This paper mainly describes the benefit of the board configuration, the first demonstration of the plastic optical fiber wiring sheet with an opening, and basic optical characteristics of the optical right-angle-turn connector.

Board-Level Optical Interconnections Using a Plastic Optical Fiber Wiring Sheet Equipped with Right-Angle-Turn Connectors.