https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

An attempt has been made to develop laser sintering incorporated with ink-jet printing of metal nanoparticles. To attain a bulk-like functionallm structure with a Ag-nanoparticle (5 nm in average diameter) paste, we have clari ed that preheating is necessary to reduce solvents in the paste before laser sintering, that sintering is to be started from the substrate using a continuous-wave, near-infrared laser beam with low-absorbance of the paste, and that atmospheric sintering without oxygen or argon atmosphere enables the nanoparticles to separate from the organic dispersant. Regarding minute wiring on a polyimide substrate, a high interface-adhesion induced by molecular-level mechanicallocking as well as a low speci c resistance of 4.8 μΩ・cm were obtained. In terms of wire-bond-pad formation on a Cu leadframe, a multistep printing process made it possible to form a 2–3 μm thick, φ 100 μm at pad near the lead apex. Pull tests reveal that the wire bondability of the laser-sintered Ag pads is as good as that of electroplated ones.

Laser Sintering Technology for Printed Electronics: Minute Wiring and Functional Coating with Ag-Nanoparticle Paste