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In this study, joining of Ni3Al intermetallic compounds using the transient liquid phase (TLP) process with Cu interlayer was investigated. The binding process was carried out in a vacuum furnace at a temperature of 1050 °C for different times of 30, 60, 90 and 120 minutes. The effect of time variation on microstructure and mechanical properties of the joint zone was investigated. The EDS analysis results of the joints proved formation of the athermally solidified zone (ASZ), isothermally * :يكينورتكلا تسپ ،تابتاكم لوئسم : a.n.bahrami@cc.iut.ac.ir D ow nl oa de d fr om ja m e. iu t.a c. ir at 7 :5 2 IR D T o n W ed ne sd ay M ar ch 2 5t h 20 20

Investigating the Joining of Ni3Al Intermetallic Compound, using Transient Liquid Phase (TLP) Method with Cu Interlayer