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Copper has limited application in coils of high magnetic field electromagnets because of its low mechanical strength. In this work, the mechanical strength of copper wire was increased through severe wiredrawing in several steps at 77 K and transmission electron microscopy (TEM), electron backscatter diffraction (EBSD) and Vickers microhardness were used to study the evolution of the microstructure of the material. Comparison of the results with those obtained processing the same material at room temperature (295 K) led to a better understanding of the hardening mechanisms. The wires drawn at 295 K showed dynamic recovery structures, while the wires drawn at 77 K showed a partial recrystallization microstructure. The fact that the Vickers microhardness of the wires wiredrawn at 77 K was about 50% higher than those wiredrawn at 295 K suggests that cryogenic deformation was effective in delaying the recovery of the material.

COMPARATIVE STUDY BY TEM, EBSD AND MICROHARDNESS OF THE MICROSTRUCTURE OF COPPER WIREDRAWN AT 77 K AND 295 K