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Neurostimulator applications will require much higher I/O feedthrough density for hermetic implantable enclosures, often greater than 100 I/O. This work evaluates the development of high-density platinum via structure cofired in alumina. The platinum was observed to melt when cofired at 1550°C, almost 200°C below its melting point, independent of the particle size (nano to micron size particles) or particle morphology. An analysis of the effect of particle size (nano to micron size Pt), firing atmosphere (air, hydrogen, inert), firing temperatures, intermetallic reactions and additives to control thermal expansion and adhesion strength was performed to evaluate and minimize this exothermic reaction. The interaction of platinum and alumina has been evaluated using X-ray diffraction and SEM.

Materials Interaction in Cofired Platinum /Alumina High Density Feedthrough for Implantable Neurostimulator Applications