English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The level of competition for a share of the burgeoning solar cell market naturally drives companies towards low-cost, high-volume subcontractors. But the stringent operating requirements in a concentrated photovoltaic (CPV) application are more consistent with the process capabilities of lower volume manufacturers. Specifications for attach of PV cells as large as 1 cm2 require the high thermal conductivity of a solder connection with minimal voiding in order to prevent current-crowding effects and thermal hotspots. These design aspects are most easily achieved through the use of lower volume, more labor-intensive batch processes such as vacuum reflow, often using expensive alloys such as 80Au20Sn. Crane Electronics in Redmond, WA, has developed an in-line solder reflow process for PV cell attach that uses standard, inexpensive solder alloys to address large die, low-voiding applications. This paper discusses the initial design and subsequent incremental improvement of that process, with supporting x-ray and yield data.

Development of a Low Voiding Solder Attach Process for Photovoltaic Cell Assemblies